Yakadhindwa Electronics
Precision Plasma Surface Kurapa kweAkadhindwa Electronics & Flexible Devices
Yepamberi plasma pamusoro kurapwa inogonesa yakavimbika adhesion kukwidziridzwa pane inonzwisisika substrates inoshandiswa mu:
- Flexible Printed Circuits (FPCs)- Activating polyimide (PI) uye PET mafirimu ekuitisa inki bonding
- OLED/LCD Inoratidza- Pre{1}}lamination treatment yeultra-thin glass (UTFG) and ITO coatings
- Din-Mabhatiri eFirimu - Kushanda kwepamusoro kweLi-ion electrode foils
|
Dambudziko |
Plasma Solution |
Technical Benefit |
|
Low pamusoro pesimba mapolima |
Oxygen/Argon/plasma inounza hydroxyl (-OH) & carboxyl (-COOH) mapoka |
Bata angle kuderedzwa kubva pa80℃→ 30℃in<1s |
|
Bvisa-zvekushandisa zvinonzwa |
Pulsed DBD plasma pa<50°C prevents thermal damage |
Nanoscale kugadziriswa (<10nm depth) only |
|
Kukundikana kwekunamatira paUTFG |
DCSBD plasma inobvisa mahydrocarboni ichiwedzera kushanda kweokisijeni |
10⁵× resistivity kuderedza mumasekete erGO |
Material-Specific Protocols
- Polyimide Films (Kapton®)
Maitiro: N₂/H₂ plasma pa20kHz, 7kV
Mhedzisiro: 60% yepamusoro inki adhesion vs. corona kurapwa
- Ultra-Thin Glass (UTFG)
Maitiro: Diffuse Coplanar Surface Barrier Discharge (DCSBD)
Mhedzisiro: 40% conductivity kuwedzera muPEDOT: PSS coatings
- Li-ion Electrode Foils
Maitiro: Atmospheric plasma neIye / O₂ musanganiswa
Mhedzisiro: 15% yepamusoro peel simba mumaseru ane laminated
- Engineer-Ready Solutions for Discharge-Sensitive Materials
Masisitimu edu anobatanidza -nguva yekuongorora impedance uye kudzora magetsi anochinjika kudzivirira kuvharidzira pa:
Tembiricha-inoziva bio-mapolima (eg, PLGA scaffolds)
Madiki-akamisikidzwa neITO nzvimbo
Porous bhatiri separators
- Bata Yedu Yepamusoro Injiniya Chikwata Kune:
▶︎ Mushumo wekuyedza kuenderana (kusanganisira WCA/SEM/XPS data)
▶︎ Gadzirisa kusimbiswa neako substrates (PI/COP/PEN)
▶︎ Pa-saiti parameter optimization kudzivirira kukuvara kwekubuda